The PRO B760-P WIFI DDR4 motherboard supports 12th & 13th Gen Intel Core, Pentium Gold, and Celeron processors.

Form Factor: ATX

Socket Type: LGA 1700

Chipset: Intel B760

With its 8 pin + 4 pin power connectors and exclusive Core Boost technology, the PRO B760-P WIFI DDR4 is able to sustain heavy CPU power loads to support system-demanding work settings:

1. Digital PWM IC
2. 12-Phase Duet Rail CPU Power (P-PAK)
3. 1-Phase GT Power
4. 1-Phase AUX Power

VRM Cooling: Features an extended heatsink, 7W/mK MOSFET thermal pads and additional choke thermal pads for improved thermal dissipation.

PCB Cooling: Premium 6-layer printed circuit design with 2 oz. thickened copper improves heat dissipation & reliability.

SSD Cooling: M.2 Shield Frozr prevents thermal throttling.

Frozr AI Cooling: Automatically adjusts system fan settings based on CPU & GPU temperatures.

Memory Boost: A fully-isolated DDR circuit delivers pure data signals for optimal gaming and overclocking performance.

XMP profiles in MSI BIOS are MSI OC LAB optimized and can be easily enabled with auto power settings for optimized memory speed and stability.

*1DPC 1R Max. overclocking frequency 5333+ MHz, supports Intel XMP.

MSI PCI Express Steel Armor slots are secured to the motherboard with extra solder points to support the weight of heavy graphics cards. When every advantage in games counts, Steel Armor also shields the point of contact from electromagnetic interference:

2 x PCIe 4.0/3.0 x16 slots* (primary slot with Steel Armor)

3 x PCIe 3.0 x1 slot

*Supports x16/x4

Even the world’s fastest SSDs will automatically slow if thermal throttling firmware detects excessively high temperatures.

M.2 Shield Frozr is MSI's most advanced thermal solution, offering the best possible protection to ensure maximum SSD transfer speed performance.

The PRO B760-P WIFI DDR4 motherboard features MSI's Gen4 M.2 slots:

2 x Gen4 x4 64Gbps slots*

*1 with M.2 Shield Frozr

2.5G LAN: A Realtek 2.5Gbps LAN controller delivers a premium network experience.

Wi-Fi 6E: Features the latest Intel Wi-Fi 6E module (ultra-low latency, high-bandwidth) & Bluetooth 5.3 technology.

USB 3.2 Gen 2 Type-C: Connect to devices and transfer files at high bandwidth rates: 10Gbps.

HD Audio: 7.1-Channel High Definition Audio with Audio Boost.